Double-sided bright copper foil is produced through a special process on the M side, transforming its rough surface into a bright one. The foil, in roll form, can be cut into rolls with widths ranging from 100mm to 1480mm. The double-sided bright electrolytic copper foil is remarkably uniform in thickness, and its crystal structure appears fine and dense when observed under a scanning electron microscope. It serves as an excellent carrier for lithium battery anode materials.

       The company's 3.5μm ultra-thin high-end copper foil can reach a single roll length of over 40,000 meters, with a thickness only one-twentieth of the diameter of a human hair. Its overall technical level is internationally leading, and it can increase the energy density by about 10% when applied to batteries with the same unit volume.

       High-strength and high-elongation copper foil exhibits excellent tensile strength and elongation, which can reduce wrinkling, strip breakage, and other phenomena caused by alternating stress during the electrochemical cycling process of lithium-ion batteries. It can also inhibit partial deformation resulting from the expansion and contraction of active materials, enhance the compaction density of the electrode plate, and reduce the thickness of the electrode plate, thereby improving the durability and energy density of the battery.

       Reverse treated foil (RTF) is a copper foil that has undergone different degrees of roughening treatment on both sides. The special feature of RTF copper foil lies in the selection of a low-roughness glossy surface for treatment, with a roughness ranging from 2μm to 4μm. It has advantages such as good etching performance and improved yield of printed circuit boards, and is widely used in the production of high-frequency and high-speed copper-clad laminates. 5G servers are its end products.

       From mechanical punching to laser drilling, the current generation features a third-generation three-dimensional porous skeleton structure. This structure enhances the conductivity of solid-state batteries and increases the contact area between active materials and current collectors, addressing issues such as uneven lithium metal deposition and dendrite formation risks. Ultimately, this contributes to improving battery performance.

       The peelable ultra-thin copper foil for IC packaging boards is a key material specifically designed for high-end integrated circuit packaging. It possesses excellent mechanical properties, tensile strength, elongation, oxidation resistance, and high temperature resistance, among other key indicators. It features high surface flatness and thickness uniformity, allowing the carrier to be peeled cleanly and smoothly. It is suitable for applications such as millimeter-wave radar, RF modules, flexible packaging, and microelectronics.

       A plating layer is formed on the surface of copper foil through electrolytic plating technology, and a uniform metal coating is formed on the surface of copper foil using physical vapor deposition technology, thereby enhancing the specific surface area, electrochemical performance, conductivity, and mechanical properties of the copper foil to meet the special requirements of solid-state batteries.